Technology platform company leveraging proprietary electro-optic polymers to transmit data at higher speeds with less power, Lightwave Logic (OTCMKTS:LWLG) on August 4, 2021 announced developing improved thermal design properties resulting in flexibility, stability as well as speed for high-volume silicon foundry processes.
A key measure of strength as well as metric discussed with potential customers for fiber optic datacenter and telecommunications applications, Dr. Michael Lebby, Chief Executive Officer of Lightwave Logic said that its in-house team created 2x improvement in r33. He said this will enable better design flexibility in high-volume silicon foundry PDK
Lebby added that the initial results show that the company’s material demonstrates unrivaled thermal performance tolerance vis-à-vis any commercial solution in use presently.
The company also announced being invited to give a presentation at the 2021 European Conference on Optical Communication, which will be in Bordeau, France in September 2021.
Dr.Michael Lebby, CEO will be participating in the Market Focus Session, which would be presenting Lightwave’s implementation of electro-optic polymer to an audience of industry experts as well as other industry participants. Lebby will also discuss the potential impact of the firm’s recently issued patents as well as improvements in the reliability of polymer stability that can improve internet speeds as well as lower power use.
“Preliminary results suggest that Lightwave Logic’s recently developed electro-optic polymer material, designed based on customer input, displays unrivaled thermal performance tolerance as compared to any commercial solution in use today. We look forward to receiving feedback on this exciting new material from our potential customers,” concluded Lebby.
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